OIS Optical Image Stabilizer lens thickness of 5.08mm, it is the thinnest, and with two ISP chips
remove all the metal shield on the motherboard
ESS ES9018K2M 32-bit Stereo Mobile Audio DAC and TI OPA1612 Operational Amplifier, This set of audio chips is currently the most high-end chips in smartphones
Samsung 3GB RAM + 2.5GHz Qualcomm Snapdragon 801 processor
Qualcomm PM8941 Power management chip
Qualcomm PM8841 Power management chip
dual SIM Card slots, support microSIM card and nanoSIM card
Toshiba 16GB ROM
Qualcomm WCD9320 Audio decoder chip
Qualcomm QFE1100 Envelope Tracking Chip
Qualcomm WTR1625L RF Transceiver, support GPS and China Beidou Navigation Satellite System
AVAGO ACP7600 RF power amplifier
Skyworks 85709-11 5GHZ wifi chip
Qualcomm WCN3680 bluetooth 4.0 chip
